NIPLATE® LINK
Electroless Nickel for Busbars and Solderable Components
Niplate Link is an electroless nickel plating treatment, covered by a patent application, specifically designed for electrical and interconnection components such as copper busbars, connectors and parts intended for soldering and brazing.
The coating provides a solderable, corrosion-resistant and long-term stable surface, significantly reducing the risk of surface oxidation that could compromise joint quality.
Thanks to the high uniformity and strong adhesion of the deposited layer, Niplate Link improves the reliability of electrical connections in power distribution systems and reduces failures caused by joint defects.
It is ideal for busbars and electrical components used in electric vehicles, inverters, battery packs and power converters, where connection reliability and long-term durability are critical requirements.
In addition, due to its excellent corrosion resistance, it can also be used in water-cooled circuits, preserving surface passivation and protecting the base material.
Compared to traditional electroplated solutions, Niplate Link offers a repeatable, cost-effective process free of precious metals, optimized for high-productivity industrial manufacturing, particularly for components with complex geometries.
PROPRIETARY TECHNOLOGY
Niplate Link is a technology developed in-house by Micron, protected by a patent application, ensuring uniqueness and a strong competitive advantage in the e-mobility sector.
SOLDERABLE SURFACE
Coating engineered to maintain excellent solderability. Compatible with tin-based and aluminum brazing alloys.
CORROSION RESISTANCE AND DURABILITY
The alloy maintains a stable, oxide-free surface even after long-term storage, ensuring consistent solderability over time.
CHEMICAL AND CORROSION RESISTANCE
Excellent resistance to corrosion and humid or saline environments. Copper components withstand over 1000 hours in NSS testing (ISO 9227) with coating thickness ≥ 5 μm.
HIGH PERFORMANCE IN E-MOBILITY
Ideal for electric vehicle busbars, inverters (IGBT) and battery systems: prevents the formation of brittle intermetallic compounds (e.g. Al-Cu) and enhances joint reliability.
UNIFORM THICKNESS
Uniform deposition even on complex geometries, without the edge thickness buildup typical of conventional electroplating processes.
TECHNICAL SPECIFICATIONS
Composition and applicable standards
| Typical composition | |
|---|---|
| Ni | P |
| 85-90% | 8-13% |
| Ni-P alloy optimized for solderability and chemical resistance | |
| Applicable technical standards |
|---|
| ISO 4527 |
| ASTM B733 |
Main applications
| Busbars for electric vehicles and HV power distribution systems |
| Contacts and terminals for batteries and inverters |
| Copper components for power electronics and smart grids |
| Parts intended for soldering or brazing in e-mobility, railway and renewable energy sectors |
Coating thickness and appearance
| Typical thickness | Tolerance |
|---|---|
| 5-15 µm | ±2 µm |
| Bright metallic appearance, stainless-steel-like color. | |
Functional properties
| Solderability |
|---|
| Excellent solderability with conventional, induction and ultrasonic brazing processes using tin and aluminum alloys; consistent wetting behavior. |
| Corrosion resistance |
| Long-term maintenance of corrosion resistance. Solderable properties preserved even after several weeks of storage under standard conditions. |
| Salt spray resistance |
| ≥1000 hours in neutral salt spray on copper substrate (ISO 9227, 5 µm thickness, corroded surface <1%). |
| Chemical compatibility |
| Excellent resistance in saline and humid environments; compatible with hydrocarbons, technical oils and alcohols. Not suitable for oxidizing acids and concentrated bases. |
Declaration of Conformity
